Topic： IEEE SENSORS 2019 presentation
Time： Wednesday18:00pm, November 6, 2019
Location： Meeting Room A228, West Building 5, Qujiang Campus
Presenter：Bing BAI,Xiaoshan TONG(白冰、同笑珊)
Conference Name： The 18th IEEE SENSORS Conference
Conference Time： 27-31 October 2019
Conference Location： Montreal，Canada
Conference Introduction：
IEEE SENSORS 2019 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of sensors and sensing technology. IEEE SENSORS 2019 will include keynote addresses and invited presentations by eminent scientists and engineers. The conference solicits original state-of-the-art contributions as well as review papers.
Topics for IEEE SENSORS 2019 include：
Sensor Phenomenology, Modeling and Evaluation
Sensor Materials, Processing and Fabrication (including Printing)
Chemical, Electrochemical and Gas Sensors
Microfluidics and Biosensors
Optical Sensors
Physical Sensors - Temperature, Mechanical, Magnetic and Others
Acoustic and Ultrasonic Sensors
Sensor Packaging (including on Flexible Materials
Information of conference paper
Title：Analysis and Simulation of the Influence of “V” Beam on the Impact Resistance of Micro Quartz Tuning Gyroscopes
Author：Bing Bai, Yulong Zhao*, Cun Li, Chao Han
Abstract：For the effect of the anchor point and the vibration structure connecting beam—"V" beam in the micro quartz tuning fork gyroscope, based on the normalized shock response spectrum in the International Organization for Standardization, the finite element analysis simulation software was used to analyze the stress of different "V" beam thickness parameters when subjected to 1500g and 2 ms half sine impact in six directions. The simulation results show that when the thickness is 80 μm, the max stress is 94.721 MPa, and when the thickness is 75 μm, the max stress is 100.512 MPa. Due to the breaking strength of the quartz material (95 MPa), the minimum thickness of "V" beam is about 80 μm. And the gyroscope with “V” beam thickness of 80 μm is verified by impact test.
Information of conference paper
Title：Micro Pressure Sensors Based on Ultra-thin Amorphous Carbon Film as both Sensitive and Structural Components
Author：Xiaoshan Tong, Yulong Zhao*, Xin Ma, Peng Guo, Qi Zhang, Mingjie Liu, Dongliang Zhang, Aiying Wang
Abstract：Amorphous carbon(a-C) is a promising material for Micro Electro-mechanical System (MEMS) due to its significant piezoresistive effect, in-situ large-area deposition and outstanding mechanical performance. In this work, a micro pressure sensor based on ultra-thin sensitive film layers (a-C/Si3N4/SiO2) is proposed. In order to measure the micro pressure change, an ultra-sensitive rectangular a-C film piezo resistor with thickness of 300 nm, width of 300 μm and length of 900 μm and an ultra-thin rectangular sensitive structure with thickness of 785 nm, width of 400 μm and length of 600 μm are designed and fabricated. The simulation and testing results show that the resistance response of the ultra-thin film, with a linear relation of differential pressure, is highly sensitive. This work shows that a-C is a potential piezoresistive material for micro pressure change detection.
